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Alumina Ceramics
Metalized Ceramics
for Brazing
Metalized Ceramics
for Soldering of Electronic Elements and Circuits
金屬化陶瓷–用于(yú)電子(zǐ)元件和(hé / huò)線路的(de)錫焊
Metalized Ceramics for Soldering of Electronic Elements and Circuits
項目 Items
單位 Unit
用于(yú)錫焊
for Soldering
作業溫度
Operation Temperature
°C
200-400
抗拉強度
Pull-Withstanding
MPa
>=10
潤濕性
wettability
>90%
(for Tin/Rosin)
打線/點焊
Bonding/Welding
(ø0.14mm copper wire)
>=150gf (no plated layer peel-off )
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